Custom photonic subsystems and mechanical modules
For requirements that fall outside the need for our standard electro-optically pluggable board form factors (including harsh-environments, space, and high-density mechanical packaging requirements), our team will design bespoke photonic subsystems and advanced mechanical modules from the ground up, drawing on the same verified circuit designs used in our DIPPS™ library.
✓ Harsh environments
✓ Space
✓ High-density mechanical packaging requirements
Not every application fits a pluggable board. Space payloads, ruggedised field instruments and application-specific enclosures often need dedicated mechanical and thermal engineering alongside the electronics.
We combine our circuit-design library with dedicated mechanical, thermal and firmware engineering to deliver a fully custom subsystem or module, packaged to the customer’s environmental and integration requirements.
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Full design freedom where a standard form factor won’t do
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Retains the speed advantage of starting from proven circuit designs, even in a custom housing
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Single team delivers electronics, firmware, software, thermal and mechanical engineering together
This capability underpins our work on space communications subsystems and portable gas-sensing instrumentation, among other applications.
Through our European and UK R&D collaborations we have developed space-resilient transceiver modules and portable gas sensing systems. Please contact us to find out more.