Solutions

DIPPS™ - Dynamic Inline Pluggable Photonic Subsystem

Photonic subsystem electronics, assembled from a proven building-block library

Overview

What this is

DIPPS™ — Dynamic Inline Photonic Pluggable Subsystems — is our platform for photonic integrated circuit control and management: a defined board form factor plus a library of pre-verified functional building blocks, including TEC control, laser driver control, bias control (single- and multi-modulator), lock-in phase amplifiers, lock-in phase-sensitive detection, FPGA/DDR3 network, and ADC/DAC front-ends.

 

Building block library

✓  TEC control

✓  Laser driver control

✓  Bias control (single- and multi-modulator)

✓  Lock-in phase amplifiers

✓  Lock-in phase-sensitive detection

✓  FPGA/DDR3 network

✓  ADC/DAC front-ends

Platform at a Glance

✓  Form factor: defined DIPPS™ board

✓  Building blocks: pre-verified function library

✓  Delivered with: firmware, control software and mechanical integration

WHY

Why DIPPS™

A photonic integrated circuit needs substantial electronic, firmware and thermal infrastructure before it becomes a usable subsystem. Building that infrastructure from a blank sheet for every new PIC or application is slow and expensive. DIPPS™ shortens that path by starting from proven, verified designs rather than a fresh design exercise each time.

DIPPS

How it works: PIC n Mix

This is where PIC n Mix comes in: you choose the function set assemble and verify a board from our building-block library inside the DIPPS™ form factor, then deliver matching firmware, control software and mechanical integration.

01

You choose the function set your subsystem needs (TEC control, bias control, lock-in detection, laser driver control, in whatever combination the application calls for)

02

We assemble and verify a board from our building-block library inside the DIPPS™ form factor

03

Then deliver matching firmware, control software and mechanical integration

Benefits

01

Faster time-to-demonstrator than a bespoke design

02

Lower non-recurring engineering cost, drawing on designs already built and verified

03

Access to circuit designs proven across multiple funded international R&D programmes

Impact

Through our European and UK R&D collaborations we have developed and proven DIPPS™ test platforms for a variety of applications including AI networks and hyperscale data-centre networks, quantum communication, space communication and gas sensing, among others. Please contact us to find out more.

AI networks
Hyperscale data-centre networks
Quantum communication
Space communication
Gas sensing
and more
DIPPS-Dynamic Inline Pluggable Photonic Subsystem

Figure 1: DIPPS™ platform for Quantum communication PIC developed on InnovateUK EQUINOX project includes TEC control, bias control, FPGA/DDR3, APDs, laser drivers, voltage switches and other advanced functions

Ready to work together?

Let’s discuss your photonics challenge.