Allowing PIC functionalities in PCIe compliant modules plugged straight into the AI server
PIC-NIC™ is our platform to bring bespoke Pic functionality straight into to your AI server. The PCIe compliant modules will incorporate the mix of bespoke PIC functionalities within a standard NIC for factor. We will draw on our library of pre-verified functional building blocks, including TEC control, laser driver control, bias control (single- and multi-modulator), lock-in phase amplifiers, lock-in phase-sensitive detection, FPGA/DDR3 network, and ADC/DAC front-ends to allow advanced functionality
✓ TEC control
✓ Laser driver control
✓ Bias control (single- and multi-modulator)
✓ Lock-in phase amplifiers
✓ Lock-in phase-sensitive detection
✓ FPGA/DDR3 network
✓ ADC/DAC front-ends
✓ Form factor: defined DIPPS™ board
✓ Building blocks: pre-verified function library
✓ Delivered with: firmware, control software and mechanical integration
A photonic integrated circuit needs substantial electronic, firmware and thermal infrastructure before it becomes a usable subsystem. Building that infrastructure from a blank sheet for every new PIC or application is slow and expensive. PIC-NIC™ builds on the same principle as our DIPPS™ platform, but moves that advanced test functionality straight into your server as a PCIe node.
Figure 2: Rack mountable DIPPS™ test platform allowing multiple individual DIPPS to be connect to each other
This is where PIC n Mix comes in: you choose the function set your subsystem needs (TEC control, bias control, lock-in detection, laser driver control, in whatever combination the application calls for) and we assemble and verify a board from our building-block library inside the PIC-NIC™ form factor, then deliver matching firmware, control software and mechanical integration.
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You choose the function set your subsystem needs (TEC control, bias control, lock-in detection, laser driver control, in whatever combination the application calls for)
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We assemble and verify a board from our building-block library inside the PIC-NIC™ form factor
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Then deliver matching firmware, control software and mechanical integration
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Faster time-to-demonstrator than a bespoke design
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Lower non-recurring engineering cost, drawing on designs already built and verified
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Access to circuit designs proven across multiple funded international R&D programmes
Through our European and UK R&D collaborations we have developed and proven DIPPS™ test platforms for a variety of applications including AI networks and hyperscale data-centre networks, quantum communication, space communication and gas sensing, among others. Please contact us to find out more.
Figure 1: DIPPS™ platform for Quantum communication PIC developed on InnovateUK EQUINOX project includes TEC control, bias control, FPGA/DDR3, APDs, laser drivers, voltage switches and other advanced functions