A complete photonic subsystem, from architecture to working prototype
For customers who need a complete photonic subsystem built from scratch (not just the electronics), we lead a standing partnership network spanning PIC design, die packaging and subsystem electronics, so a single engagement can take a concept from architecture through to a working, packaged subsystem.
✓ PIC Design
✓ Die Packaging
✓ Subsystem electronics
A complete photonic subsystem draws on specialist capability that rarely sits inside one organisation: photonic circuit design and fabrication, photonic packaging, advanced optical interconnect and subsystem electronics and control. Assembling that capability freshly for every project is slow and adds risk. A standing partnership removes that friction.
We work with established PIC design partners, specialist photonics packaging houses, advanced component suppliers with Resolute Photonics coordinating the programme and delivering the subsystem electronics, firmware, software, thermal management and mechanical integration around the packaged PIC.
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One point of contact for a complete subsystem, from concept to prototype
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Each partner contributes proven, specialist capability rather than one team attempting all of it
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Faster and lower-risk delivery than assembling a bespoke supply chain per project
This is the model behind EQUINOX, our quantum photonic networking subsystem programme, delivered with NPL, Cornerstone, Wave Photonics, Senko and Seagate, and behind HIKARU, our satellite communications subsystem programme with Senko, AIO Core and STFC.